Optimizing Data centers with ODFs: Cross-connect cabling and Mass-fusion splicing

ODFs (Optical Distribution Frames) play a critical role in optimizing data center infrastructure, particularly when it comes to cross-connect cabling within white spaces. These frames help efficiently manage a large volume of connections between servers and switches, streamlining processes like identification, labelling, and traceability. Additionally, ODFs make it easier and faster to add or remove patch cords, ensuring smoother network installation and maintenance.

Cross-connect cabling in white spaces typically involves mirroring core or spine switch ports on one side of the Optical Distribution Frame (ODF). On the opposite side, top-of-rack patch panel ports are presented, facilitating connections to servers, leaf switches, or access switches.

By cross-connecting various ports within the ODF, links between servers and switches are quickly established. A common transmission method used in these connections is duplex transmission, which requires only two fibers and a duplex connector. This setup is simple, yet effective, ensuring organized and efficient cabling that enhances both management and scalability within the data center.

The cross-connect approach offers several key advantages that significantly improve data center operations:

• Centralized management: Acts as a central hub for all connections, providing clear visibility of switch and server connections.

• Pre-deployment of permanent links: Cross-connect cabling allows for permanent links to be pre-deployed to an ODF, eliminating point-to-point or home-run connections.

• Simplified cabling: Uses a single patch cord type (typically available in one or two lengths), reducing complexity and potential for errors.

• Efficient network changes: Enables pre-wiring and securing of valuable switch ports, eliminating the need for re-patching during network updates.

• Aggregation of data rates at the lane level: High-speed transceivers often transmit data across multiple lanes (e.g., 4 × 100G). The cross-connect system enables these individual lanes to be efficiently distributed across duplex ports, maximizing flexibility in network design.

By streamlining the cabling process and providing greater flexibility, cross-connect cabling enhances overall network management and scalability.

LISA is a dedicated optical distribution frame that serves as a cross-connect point, while IANOS is a modular patch panel designed for integration into 19-inch racks. Both systems have now been upgraded to support mass-fusion splicing, offering a variety of advantages for data center cabling.

Mass-fusion splicing significantly reduces installation time and improves optical link budgets. In comparison to traditional single-fiber splicing, mass-fusion splicing is nearly three times faster, making it the ideal choice for rapid network deployment. Additionally, fusion splicing results in lower signal loss compared to pre-terminated cabling.

Pre-terminated cables require precise planning, and even small layout changes can lead to supply chain challenges. Fusion splicing, however, simplifies the bill of materials—only requiring enough cable to be cut to length on-site, making it both a more flexible and cost-effective solution.

Developed by SENKO, the SN connector is a next-generation VSFF (Very Small Form Factor) connectivity solution designed to maximize fiber density and improve network scalability. By doubling or even tripling the capacity of traditional LC connectors, SN technology provides the high-density interconnect needed for modern data centers, cloud infrastructure, and high-performance computing environments.

Unlike MPO multi-fiber solutions, SN connectors retain duplex functionality while achieving nearly the same level of density, making them an ideal choice for hyperscale and enterprise data centers. Built on trusted Carrier-Grade 1.25mm ceramic ferrule technology, the SN connector ensures superior optical performance without compromising reliability.

SENKO continues to lead the evolution of fiber optic connectivity with SN technology, enabling faster, more efficient network deployment and seamless scalability.

Cross-connect cabling enables connections within the ODF to be made using interfaces that may not be compatible with transceivers. VSFF patch cords, such as SN to SN, can be used to significantly increase port density, offering up to three times more connections compared to traditional LC-based connectivity.

SN connectors also provide a benefit in top-of-rack panels, allowing for more connections in space-constrained areas. To maintain compatibility with transceiver interfaces, hybrid patch cords (SN to LC) can be utilized. HUBER+SUHNER’s data center portfolios, LISA and IANOS, now include SN-compatible modules and cassettes, enabling ODFs to support up to 6,480 ports, while patch panels can accommodate up to 432 ports in just 1U.

To further streamline installation, compact ribbon cables, specifically designed for data centers, are employed. Instead of deploying individual cables for each connection, breakout cables can be used to serve multiple racks with a single cable. This reduces cable pulling time and ensures more efficient routing and securing, whether inside the ODF (LISA) or within switch and server cabinets (IANOS).